copper alloys which have a high strength and at the same time a high electrical conductivity. High performance alloys are used e.g. for connectors . Often HPAs are formed by a certain mechanism called precipation hardening . Examples for HPAs are copper-iron, copper-nickel-silicon, beryllium copper and copper-zirconium HPAs are often tin-plated either by hot dip tinning or electroplating.
see also: precipitation hardening
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